Multiple Layer Printed Circuit Boards and Method of Manufacture

摘要

A printed circuit board (10) and method of manufacture thereof is disclosed. The printed circuit board (10) includes a first substra te provided from a conductive layer (12) having disposed on a first surface (12 a) thereof a cured adhesive layer (14). A semi-cured adh esive layer (16) is then disposed over the cured adhesive layer (14) and a second substrate (18) is disposed against the semi-cured adhesi ve layer (16).