| 摘要 |
PURPOSE:To laminate metallic foils on an inner layer circuit sheet by a method wherein long resin impregnated base materials as well as long metallic foils are continuously fed to be laminated on the surface of the inner layer circuit sheets for setting the impregnated resin in the resin impregnated base materials. CONSTITUTION:A long band type inner layer circuit sheet 2 wound up around a roll 10 is used. On the other hand, long band type base materials 17 are continuously drawn out of the other rolls 10 to pass through impregnating vessels 18 so that the base materials 17 may be impregnated with resin varnish 12 to manufacture resin impregnated board 4. Next, the laminated body 20 comprising the laminated inner layer circuit sheet 2, the resin impregnated board 4 and metallic foils 5 is continuously fed to a thermo-setting furnace 21 for thermo-setting the impregnated resin in the resin impregnated board 4 so that a lamination-set body 22 comprising both surfaces of the inner circuit sheet 2 whereon the metallic foils 5 are laminated through the intermediary of the set resin layer of the resin impregnated board 4 may be manufactured. Finally, the lamination-set body 22 is cut off in a specific dimension by a cutter 23, the metallic foils 5 are etched away to form outer layer circuits furthermore, through holes are made to manufacture the title multilayer printed-wiring board A. |
