发明名称
摘要 <p>PURPOSE:To improve an adhesive state, to interrupt the intrusion path of water and to enhance damp-proofing by constituting a sealing plastic package by using an epoxy resin composition as a special reaction product. CONSTITUTION:A sealing package is organized by employing an epoxy resin, a reaction product from a silane compound having at least one of a methoxy group and an ethoxy group in a molecule and a phenol resin, and inorganic fillers. The epoxy resin has two or more of epoxy groups in one molecule. THe reaction product from the silane compound having at least one of the methoxy group or the ethoxy group in the molecule and the phenol resin functions as a curing agent for the epoxy resin, and is acquired by arbitrarily combining the phenol resin and the silane compound and reacting them. Quartz glass powder and crystalline silica powder are proper as the inorganic fillers.</p>
申请公布号 JPH0717739(B2) 申请公布日期 1995.03.01
申请号 JP19850242465 申请日期 1985.10.28
申请人 NITTO DENKO CORP 发明人 ITO TATSUSHI;TABATA HARUO
分类号 C08G59/00;C08G59/62;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08G59/62 主分类号 C08G59/00
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