发明名称 Thin film for semiconductor device and manufacturing method of thin film for semiconductor device.
摘要 Purpose: To realize a type of thin film with excellent embedding characteristics, good control of thin film thickness, low dielectric constant, very low hygroscopicity, and excellent compressive stress. Configuration: A first formation layer (L1) with excellent compressive stress is formed from the TEOS gas using the PECVD method; a second formation layer (L2) with a lower compressive stress yet excellent embedding characteristics, low dielectric constant, and other excellent properties is formed from a gas mixture of TEOS gas and halogen gas using the PECVD method; these first and second formation layers (L1, L2) are combined appropriately to form a laminate configuration made of several layers laminated to each other. <IMAGE>
申请公布号 EP0633605(A3) 申请公布日期 1995.03.01
申请号 EP19940109806 申请日期 1994.06.24
申请人 APPLIED MATERIALS INC 发明人 MUSAKA KATSUYUKI;MIZUNO SHINSUKE C O APPLIED MA
分类号 C23C16/50;H01L21/205;H01L21/31;H01L21/316;H01L21/768 主分类号 C23C16/50
代理机构 代理人
主权项
地址