SEMICONDUCTOR CHIP RESIN SEALING DEVICE

摘要

PURPOSE:To automate loading and unloading of a lead frame. CONSTITUTION:On a mold stage 50, a loading frame lead-in/delivery mechanism 33 and a loading frame lift/lower mechanism 34 are provided. The mechanism 33 makes a loading frame 63 having a lead frame placed thereon move horizontally between a position in front of a semiconductor chip resin sealing device body and a position at an upper side of a lower mold. The mechanism 34 lifts and lowers the loading plate 63 which is led in. The mechanism 34 is lowered so as to place the lead frame on the lower mold. It is lifted after resin molding and the lead frame having a resin package formed thereon is made to float from the lower mold so as to be supported on the loading plate.