| 摘要 |
Multijunction thermal converters are formed in an integral multifilm membrane form over a through opening in a nonmagnetic, dielectric substrate. Through the use of conventional photolithographic and etching techniques, very compact, rugged and precise integrated structures are formed to include either single linear elongate heater elements, bifilar or trifilar heater elements, and multijunction thermopiles at reasonable cost. Disposition of the heater element and hot junctions of the thermopiles over a through opening in the substrate, with the cold junctions of the thermopiles disposed over the substrate thickness, enables the heating element to provide a substantially isothermal uniform heating of the thermocouple hot junctions to obtain high thermal efficiency and reduce Thompson and Peltier heating effects. Forming the essential elements into an integrated multifilm membrane also makes possible minimization of interconnections between the elements, and this results in minimized reactance. The resulting thermal converters are relatively inexpensive and rugged, have high sensitivity, superior ac-dc and RF-dc performance characteristics, and provide broader bandwidth performance than is possible with conventional devices.
|
