| 摘要 |
PURPOSE:To provide a polishing method of a wafer and the device therefor in which the thickness of a film can be known without separating a wafer from a surface plate during polishing, and accurate control of the polishing can efficiently be performed. CONSTITUTION:In a polishing method in which a wafer 7 fixed on a wafer supporting plate 8 is pressed against the surface of a polishing cloth 5 stuck on a rotating surface plate 1 and polished while dropping polishing liquid on the surface of the cloth and rotating the wafer by means of the wafer supporting plate 8, the polishing is carried out while judging the polishing condition by observing the light reflecting condition of the polishing surface of the wafer 7 through a transparent window 4 provided between the rotational center of the surface plate 1 and the polishing cloth 5 and the circumferential edge by means of an image pickup device using a charge coupled element, an image display device, and a spectral reflection factor measuring device. |
