发明名称 ULTRAFINE BORING METHOD
摘要 PURPOSE:To easily form an ultrafine hole in a work consisting of ceramics, etc., by arranging ultrafine powder particles at the processing point of the work surface and irradiating these particles with a laser beam, thereby heating up the particles to an ultrahigh temp. CONSTITUTION:A sodium oleate is added to a hexane soln. contg. ultrafine powder 2 of tungsten and this soln. is applied on the surface of an alumina substrate 1. The ultrafine particles on the surface are made into a single layer by ultrasonic vibration. The hexane soln. is then allowed to evaporate by air drying, by which the ultrafine particles 2 of the tungsten are uniformly stuck on the substrate surface. The processing point is previously irradiated with the laser beam 3 and only the tungsten powder at the central point of the laser beam is irradiated with the laser beam by controlling its energy according to the kind of the substrate, by which temp. of the the tungsten powder is controlled. The tungsten powder 2 changed to the high temp. is adhered to the substrate 1 and thereafter, the substrate is washed by the hexane liquid to remove the non-adhered tungsten. The irradiation with the laser beam is then executed, by which the ultratine hole 4 is formed.
申请公布号 JPH0751874(A) 申请公布日期 1995.02.28
申请号 JP19930207725 申请日期 1993.08.23
申请人 SAKAE DENSHI KOGYO KK;OBA KAZUO;SHIMA YOSHINORI;OBA AKIRA 发明人 OBA KAZUO;SHIMA YOSHINORI;OBA AKIRA
分类号 B23K26/00;B23K26/38;B28D1/14;H05K3/00 主分类号 B23K26/00
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