MANUFACTURE OF MOLDING DIE AND SEMICONDUCTOR DEVICE

摘要

PURPOSE:To avoid generation of voids in parts filled and unfilled with a molding resin by providing a plurality of pots for supplying the molding resin with pressure and making each pot have one runner to be connected thereto. CONSTITUTION:At sealing of molding resin, for example, four pots 2 are arranged in the center of a bottom tool 4. One molding resin tablet 9 is provided in each of the pots and preheated. The tablets 9 are pressed by a plunger attached to a press cylinder. Each cavity 6 is filled with the molding resin 1 uniformly from a runner 3 exclusively used for each pot 2 through each gate 5 and sealed. Thereafter, pressure is raised so as to eliminate unfilled parts in the cavities 6. The molding resin 1 is taken out after it is cured.