| 摘要 |
A capacitance type accelerometer, having a fist silicon plate formed a movable electrode which is moved according to acceleration, two second silicon plates which are disposed on both sides of the first silicon plate with a certain separation distance, and thermal oxide films which are respectively disposed between the first silicon plate except the movable electrode and the two second silicon plates and stick the first silicon plate except the movable electrode and the two second silicon plates together. And further, a capacitance type accelerometer, having, a silicon plate formed a movable electrode which is moved according to acceleration, glass plates respectively mounting a conductive layer thereon which are opposite to the silicon plate with a certain separation distance and are sticked to the both side of the silicon plate except the movable electrode and leading wires which are respectively connected to the conductive layers through a groove formed between the silicon plate and the glass plates respectively deriving. These capacitance type accelerometers are made by processing and cutting a wafer by dicing saw without coming into the accelerometer of cutting chips or cutting water.
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