| 发明名称 |
BONDING METHOD AND APPARATUS FOR SEMICONDUCTOR CHIP |
| 摘要 |
PURPOSE:To carry out the heat pressure bonding with no pressure application nor vibration due to the dicollet, by spraying the inactive gas to the chip. |
| 申请公布号 |
JPS5434679(A) |
申请公布日期 |
1979.03.14 |
| 申请号 |
JP19770100792 |
申请日期 |
1977.08.23 |
| 申请人 |
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发明人 |
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| 分类号 |
H01L21/52;H01L21/58;H01L21/68 |
主分类号 |
H01L21/52 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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