| 摘要 |
PURPOSE:To enhance the thickness accuracy of a wafer by minimizing the ingot sending-in speed on a position of 55-70% of the diameter from the start of the cutting of a round ingot, and continuing the change of the sending-in speed at cutting start and end parts. CONSTITUTION:When a wafer is produced by cutting a round ingot in the diameter direction thereof by a wire saw, the ingot sending-in speed from the cutting start part 3 of the round ingot to the 55-70% lines 5, 6 on the diameter of the ingot is minimized and set to 2-4 times and 1.2-2 times at the cutting start part 3 and a cutting end part 3, 7 and both speed changes are continuously performed. Therefore, a wire diameter change or slackening due to the abrasion of the wire saw is covered and the substantial cutting speed of the wafer becomes constant and the thickness accuracy of the wafer is improved. |
