| 摘要 |
PURPOSE:To decrease the number of the component parts by substituting the header of the lead wire for the copper plate. CONSTITUTION:Header 6 of the lead wire is formed into a disc or square shape with the area same as or larger than semiconductor chip 1. The material uses the copper coated with silver, and the plate thickness is set to such value through which the heat storage action may be fully utilized. Semiconductor chip 1 is then soldered (3) to the bottom of concave base 2, and header 6 of lead wire 5 is soldered (3) onto the upper surface of the chip. Then Si rubber 7 is injected, and the opening part is sealed up by sealing material 8. With use of the lead wire of such structure, the assembling work is simplified, and the parts can be set at the correct position with the uniform solder thickness secured. |
