发明名称 Deposited film formation method utilizing selective deposition by use of alkyl aluminum hydride
摘要 By providing a deposited film formation method in which aluminum or a metal composed mainly of aluminum of good quality is selectively deposited according to the CVD method utilizing an alkyl aluminum hydride and hydrogen, and then pure aluminum or a metal composed mainly of aluminum is non-selectively deposited, it becomes possible to form an electroconductive film of good quality within fine openings or on an insulating layer.
申请公布号 US5393699(A) 申请公布日期 1995.02.28
申请号 US19920969353 申请日期 1992.10.30
申请人 CANON KABUSHIKI KAISHA 发明人 MIKOSHIBA, NOBUO;TSUBOUCHI, KAZUO;MASU, KAZUYA
分类号 C23C16/20;C23C14/34;C23C16/02;C23C16/04;C23C16/18;H01L21/28;H01L21/285;H01L21/3205;H01L23/52;(IPC1-7):H01L21/44 主分类号 C23C16/20
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