Method of bonding a conductor composition including a lithium compound to an aluminum nitride substrate

摘要

The present invention provides a method of adherently depositing a thick film composition on an aluminum nitride substrate comprising the steps of providing an aluminum nitride substrate, providing a thick film composition, and applying the thick film composition on the aluminum nitride substrate. The thick film composition includes a glass frit binder, a conductive metallic material and a lithium-containing adhesion promoting compound.