Starr-flexible Leiterplatte und Verfahren zur Bildung derselben.

摘要

In a process for manufacturing a rigid-flexible printed circuit (40) wherein a rigid insulating layer (42) supports one portion of the printed circuit and a flexible insulator (44,45) supports another portion thereof to furnish flexible leads for connection the printed circuit to an operative device, a first assembly is provided comprising a curable prepreg insulator layer (100,100 min ) having an opening (102) for the flexible leads. A flexible sheet (104,104 min ) spans the opening, and the assembly is pressed with one surface in contact with a smooth hard surface (112) while the other surface is supported against a flowable durable prepreg layer (108). Between the insulator and flowable layers is a release layer (110,110 min ) which prevents bonding between the prepreg layers throughout most of the areas while permitting bonding along the edges. The assembly is maintained under heat and pressure to partially cure both prepreg layers and bond the flexible sheet to the edges of the opening and bond the edges of the prepregs together to form a flat rigid sandwich. A sheet of copper (116) is bonded to that surface previously in contact with the hard surface, in a second pressing operation, the copper being bonded to both the partially cured prepreg layer and the flexible sheet, and thereafter the bonded edges of the cured prepreg layers, are severed to permit separation of the cured prepreg layers.