Optisches Modul.

摘要

In an optical module with a substrate (6) having an optical unit (3) mounted thereon being provided on a bottom of a package (8) and having the optical unit optically coupled with an end of an optical fiber (1) extending into the package (8), a chip carrier (2) including the optical unit (3) is die-bonded to a conductive land (7) formed on the substrate (6), and a recess (10) is formed at an area of the bottom of the package (8) which faces the land (7). Thus, a capacitance of a parallel-plate capacitor formed by the land (7) and the bottom of the package (8), which prevents a high speed operation, is rendered negligibly small.