发明名称 |
Anisotropleitendes Material und Verfahren zum Anschliessen integrierter Schaltkreise unter dessen Verwendung. |
摘要 |
An anisotropic conductive material includes micro-capsules dispersed in a bonding resin. The micro-capsules contain, as a filler material, a conductor and a polymerization initiator, a curing agent or a curing promotor. A wall member encapsulating the filler material is formed of a thermoplastic or thermosetting insulative resin. Therefore, if the micro-capsules in the anisotropic conductive material are broken or destroyed by pressure or both of pressure and heat, electrical connection can be established between electrode pads and electrode terminals of a wiring substrate through the conductors contained in the micro-capsules. Simultaneously, the polymerization initiator, the curing agent or the curing promotor flows out, so that the insulative bonding resin is solidified. Thus, the anisotropic conductive material has a high connection reliability, a good reproducibility, an excellent packaging workability, and excellent shelf stability. <IMAGE> |
申请公布号 |
DE69201159(D1) |
申请公布日期 |
1995.02.23 |
申请号 |
DE1992601159 |
申请日期 |
1992.05.07 |
申请人 |
NEC CORP., TOKIO/TOKYO, JP |
发明人 |
MATSUI, KOJI, C/O NEC CORPORATION, MINATO-KU, TOKYO, JP |
分类号 |
C08K9/10;C08K9/08;C08L101/00;H01B1/22;H01B5/16;H01L21/60;H01L23/498;H01L23/50;H01R11/01;H01R13/24;H05K3/32;(IPC1-7):H01B5/16;H01L21/607 |
主分类号 |
C08K9/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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