The invention relates to a multilayer substrate for electrical circuits or components, consisting of a multiplicity of ceramic layers and metallisations. In order to improve dissipation of heat, a cooling body formed by at least one copper layer is provided on one surface side of the multilayer substrate.
申请公布号
DE4328353(A1)
申请公布日期
1995.02.23
申请号
DE19934328353
申请日期
1993.08.24
申请人
SCHULZ-HARDER, JUERGEN, DR.-ING., 91207 LAUF, DE;MAIER, PETER H., 91207 LAUF, DE
