A power converter module (1) is specified which consists of at least one power semiconductor module (2) and a cooling body (5). The cooling body (5) is flowed through by a coolant liquid (8) and has a flow cavity (9) for this purpose. In order for heat exchange from the power semiconductor module (2) to the coolant liquid to take place as efficiently as possible, coolant fluid washes directly against the underside (7) of the power semiconductor module (2). The underside of the power semiconductor module thus hermetically seals the flow cavity. An intermediate surface is no longer required. <IMAGE>
