Verfahren zur Herstellung einer oberflächenmontierbaren Leiterplatte.

摘要

A method of manufacturing a surface-mounted wiring board, according to the present invention comprises the steps of: forming a plurality of die pads and bonding pads, which are composed of Cu or Ni and arranged at predetermined areas of a wiring board, being electrically connected between the die pads and between the die pad and the bonding pads; forming an Au-plated coating on each of the formed pad surfaces by electroplating; and electrically isolating the Au-electroplated pad surfaces from each other by selectively cutting away part of a predetermined area on the wiring board thereby to separate the conductors electrically interconnecting the pads.