发明名称 Method for producing an assembly having an electronic component, an assembly having an electronic component as well as a circuit which is implemented using the method and using the assembly
摘要 The invention relates to a method for producing an assembly having an electronic component which has soldered wires, as well as junction connections, in particular of an assembly having varistors for protection of the windings of a three-phase machine. The invention is characterised by the following features: a board made of non-conductive material, for example plastic, and a number of contact plates are placed flat one on top of the other; holes are provided in the board and the contact plates which are in each case drilled through the two components, the board and the contact plate; a soldered wire of the electrical component is in each case passed through a hole so that the free end of the relevant soldered wire projects beyond that side of the contact plate which is opposite the board; the projecting end of the individual soldered wire is soldered to the contact plate.
申请公布号 DE4327517(A1) 申请公布日期 1995.02.23
申请号 DE19934327517 申请日期 1993.08.17
申请人 REISMANN, HANS-JOACHIM, 74523 SCHWAEBISCH HALL, DE 发明人 REISMANN, HANS-JOACHIM, 74523 SCHWAEBISCH HALL, DE
分类号 H05K3/20;H05K3/32;H05K3/34;H05K3/38;H05K3/40;(IPC1-7):H05K13/00 主分类号 H05K3/20
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