Securing heat sinks to semiconductor packages

摘要

A mounting clip for securing a heat sink to a device package is secured to the heat sink by forming a groove in the heat sink, positioning the central body portion of the clip in the groove and deforming the wall of the groove to trap the clip in the groove. The clip is an elongated body with ends extending from the axis of its central body. The ends may be trapped or hooked in appropriate receivers on a frame or socket holding an electronic device package to secure the heat sink adjacent the device package.