| 摘要 |
An accelerometer is provided which has a silicon substrate (14) bonded to a silicon capping plate (30) and a silicon back plate (32), wherein the bonds (26,28) between the three silicon wafers are characterized by a relatively low residual stress level over a wide temperature range. The bonds (26,28) are formed by means of an appropriate adhesive at a relatively low temperature without degradation to the accelerometer. The bonds (26,28) between the silicon wafers also provide stress relief during use and packaging of the accelerometer. The damping distance for the proof mass of the microaccelerometer can be accurately controlled and stop means (42,44) are provided for preventing excessive deflection of the proof mass (12) in a direction perpendicular to the plane of the accelerometer. <IMAGE> |
