| 摘要 |
<p>PURPOSE:To prevent manufacture defects from occurring due to the change of the posture of an insulating substrate (A1) in the transfer process of a lead frame (1), in the lead frame (1) where the electronic components are manufactured by projecting axes (4) on the terminal plates (3) being projected laterally in large numbers at proper intervals at the side margins of a frame (2), and putting the insulating substrates (A1) of electronic components (A) on these axes (4), and then, performing subsequent various kinds of processes, and lastly, cutting off the terminal plates (3). CONSTITUTION:An auxiliary bar 6 extending in the same direction as the terminal plate 3 is connected integrally at each section positioned between the terminal plates 3 cut of the side margin of the frame 2, and a holding piece 7 to the insulating substrate A1 is made in each auxiliary bar 6. The top of each auxiliary bar 6 may be coupled to the tie bar 8.</p> |
