发明名称
摘要 <p>PURPOSE:To make the device compact and to reduce the manufacturing cost, by fixing a semiconductor element on a leadframe in the electrically insulated state, connecting one electrode on the semiconductor element to a leadframe through a wiring, and using the leadframe as one of outer terminals. CONSTITUTION:An electrode, which is taken out of a P-type semiconductor region 18 that is an anode, is connected to a protruded part 41 that is provided on a mounting bed 14. An electrode, which is taken out of an N-type semiconductor region 20 that is a cathode, is connected to a leadframe 12. A light receiving side is assembled together with a light emitting side, in which a light emitting diode is fixed on the leadframe in the facing state. Thus an outer container and a light path are formed by resin mold. In this equivalent circuit of a thyristor and a photocoupler, only two terminals 38 and 40 are provided on the light receiving side and extra outer terminals are not required on the light emitting side. The outer terminals can be reduced on both light receiving and emitting sides. The six pins on the outer terminal are reduced to the four pins. Thus the external configuration can be made more compact than that of a conventional device, and the manufacturing cost can be reduced.</p>
申请公布号 JPH0716015(B2) 申请公布日期 1995.02.22
申请号 JP19850083078 申请日期 1985.04.18
申请人 发明人
分类号 H01L31/12;H01L21/60;H01L23/50;H01L31/02;H01L31/0232;H01L31/16;(IPC1-7):H01L31/023 主分类号 H01L31/12
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