Device for aligning the contact feet arranged on the edge of an IC component

摘要

A device for aligning the contact feet (2) arranged on the edge of an IC component has a comb-shaped alignment tool (C), the prongs (6) of which are moved into the gaps between the contact feet (2). During an upward movement of the alignment tool (C) in the direction of the Z axis, a first alignment plate (D), which engages over the gaps (7) between the prongs (6) and is arranged underneath the latter, comes into contact with the contact feet (2) which are therefore bent upwards. In a subsequent downward movement of the alignment tool (C), a second alignment plate (F), arranged above the prongs (6), comes into contact with the contact feet (2) and bends them all downwards to the specified dimension.