| 摘要 |
A cream solder is printed on the bonding position of a hole and a parts of chip on the printed circuit board. The chip parts and lead parts are arranged at the fixed position, and soldered in the gross. A stencil having several transcribing holes is installed on the same position of lead frame holes and chip parts. A fixed quantity of the cream solder is squeezed in the transcribing hole of the stencil.
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