| 摘要 |
PURPOSE:To remove a chip from a bond stage without scratching nor contaminating the chip by retreating the chip from the bond stage while the chip is held on a collet by vacuum suction. CONSTITUTION:When the heating time of a chip 5 has elapsed after the chip 5 is mounted on a bond stage 8, the cylinder 35 of a chip relieving device 20 is driven to protrude an actuating rod 35a and a shaft 25 is lowered. As a result, a collet 41 moves immediately above the bond stage 8 from a rescue stage 52 and comes into contact with the chip 5 on the stage 8. When it is detected that the collet 41 comes into contact with the chip 5, the chip 5 is attracted to the collet 41. When the chip 5 is attracted to the collet 41, the driving of the cylinder 35 is turned off and the shaft 25 rises. Thereafter, either the chip 5 is transferred to the rescue stage 52 or the chip 5 is returned to the bond stage 8. |
