| 摘要 |
PURPOSE:To obtain a through hole and a pattern which have a desired form, by a method wherein the through hole and the pattern are processed in an organic film formed by laminating at least two layers or more, which have different etching rates to one kind of an etching liquid, with the one kind of the etching liquid. CONSTITUTION:A polyimide layer A2 having an etching rate quicker than that of a polyimide layer B3 and the polyimide layer B3 are laminated on a substrate in two layers in such a way that the layer A2 is formed as the lower layer of the two layers in a thickness of 5mum and the layer B3 is formed as the upper layer of the two layers in a thickness of 5mum and moreover, a photoresist 4 is formed on the layer B3 in a thickness of 2mum (a). Then, a hole part of a diameter of 30mum is patterned in the photoresist 4 (b). Moreover, the layers B3 and A2 are etched using an etching liquid (c). Lastly, the photoresist 4 is removed using a resist release solution to obtain a through hole pattern, which has a diameter of 40mum in the upper surface part of the layer B3, in the layer B3 and a through hole pattern, which has the form of a diameter of 30mum between the layer A2 and the substrate surface part, in the layer A2 (d). By the above method, a through hole and a pattern, which have a desired form and a desired dimension, are obtained. |
