| 摘要 |
PURPOSE:To protect a package against cracking at reflow soldering or molding. CONSTITUTION:A semiconductor chip 103 is mounted on a die pad 101 through the intermediary of a die bonding material 102, which are sealed up with sealing resin 106 into a semiconductor device. At least one V-shaped groove is cut in the surface of a package, whereby the sealing resin 106 can be enhanced in bending strength. |
