| 摘要 |
<p>PURPOSE:To provide a method of sealing a semiconductor device with resin high in productivity at a low molding temperature at which eutectic solder used for the inner connection of a circuit assembly is not melted again. CONSTITUTION:A semiconductor device is sealed with resin through such a method that a circuit assembly which includes a semiconductor chip 3 formed on a lead frame 2 is mounted on a heat dissipating metal insulating board 1 and jointed together with eutectic solder 7, and the periphery of the circuit assembly is sealed with resin making the underside of the metal insulating board 1 exposed for the formation of a resin-sealed semiconductor device, wherein mold releasing agent is previously applied onto the underside of the metal insulating board 1. The circuit assembly mounted on the metal insulating board is inserted into an injection molding die 8, and liquid epoxy resin is filled into the cavity of the die 8 at molding temperatures of 140 deg.C to 180 deg.C to form a sealing resin layer.</p> |
