| 摘要 |
PURPOSE:To enhance a mounting wiring section in thermal stress and reliability by a method wherein a coating film which protects the mounting wiring section against moisture and a cover which protects the mounting wiring section against mechanical damage are separately provided. CONSTITUTION:A bare IC chip 2 is die-bonded to a wiring board 1, and the first pad 4 of the bare IC chip 2 is connected to a second pad 3 provided onto the wiring pattern on a wiring board 1 with a bonding wire 5. A resin film 6 as thick as tens to hundreds of mum is formed on this mounting wiring section through a melt dipping method. Furthermore, the mounting wiring section is covered with a cap 7 formed of material high in mechanical strength, and the edge of the cap 7 is fixed to the wiring board 1 by bonding agent 8. A thin film is used to seal up the mounting wiring section so as to screen it from moisture or impurity ions to protect a sealed body against deformation or cracking due to thermal stress. Furthermore, the mounting wiring section and the thin film are covered with a cap or the like so as to protect against mechanical damage due to an impact or an external force. |
