| 摘要 |
PURPOSE:To provide a wire bonding inspecting method by which a wiring bonding position on a pellet can be automatically, easily, and surely recognized. CONSTITUTION:A black-and-white picture, in which a bonding wire 13, inside chamfer 15, and part of a circuit pattern 16 on a pellet 11 are shown in white color and the other area is indicated in black color is produced by thresholding and black-while inverting a picture a1 taken by using a vertical lighting device (b1). Then a picture b2 in which the wire 13 and a bonding hole 14 are a little reduced is produced by performing thresholding and a reduction logic filtering process on a picture a2 taken by using a ring lighting device (b2). Then a bonding position is recognized by repeating the reduction logic filtering process and picture histogram by using a picture (c) obtained by synthesizing the pictures b1 and b2 (c). |
