发明名称 METHOD AND DEVICE FOR BENDING LEAD
摘要 PURPOSE:To discriminate the nondefective and defective bending and temporary fixing of a lead of an electronic component with the lead inserted into the lead inserting hole of a printed board. CONSTITUTION:A photoelectric sensor 10 with a light-emitting device 19 and a photo-detector 21 positioned at the slightly upper places of the extension of a line tying the tips of leads 5, 5 inserted into the lead inserting holes of a printed board 1 so as to hold these leads and a pair of clinches 7, 7 for bending the leads are provided. Whether or not the projecting end sections of the leads are positioned between the light-emitting device and photo-detector of the photoelectric sensor is detected regarding the state of the insertion of the leads into the lead inserting holes of the printed board, and the completion of the bending of the leads is detected when the leads projected from the printed board are bent by a pair of the clinches and the leads are not placed between the light-emitting device and photo-detector of the photoelectric sensor.
申请公布号 JPH0745997(A) 申请公布日期 1995.02.14
申请号 JP19930208146 申请日期 1993.08.02
申请人 SONY CORP 发明人 YAMAZAKI HIROSHI;ITABANE YOSHITADA;TAKAHASHI KATSUE
分类号 B23P21/00;G01B11/00;G01B11/24;H05K13/04 主分类号 B23P21/00
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