| 摘要 |
<p>PURPOSE:To make a thin-film integrated circuit chip cheap without the deterioration of its characteristic and to improve its reliability and productivity, by using a silicon substrate for solar batteries as the substrate of the thin-film integrated circuit chip to be combined with a layered body. CONSTITUTION:A layered body 110 is configured in a layered way out of a layered type inductor 105, a layered type capacitor 106, and a resistor circuit 107 comprising resistors 108 and conductors 109. At fetching terminals 104, the layered body 110 is connected with a thin-film integrated circuit chip 100 by pad electrode 103 comprising the solder bumps of the chip 100. The thin-film integrated circuit chip 100 is formed while an active silicon film 101 is formed on a polycrystal silicon substrate 102 for solar batteries via a silicon oxide film, etc., and thereafter, a semiconductor process is applied thereto. Therefore, the thin-film integrated circuit chip 100 can be created using the silicon substrate 102 for solar batteries, and generally, the silicon substrate for solar batteries can be obtained at a very low price in comparison with a silicon wafer subjected to a mirror finished surface polishing.</p> |
