| 摘要 |
PURPOSE:To obtain a conductor pattern hard to strip even when an interlayer insulating layer is not roughened by chemicals by a method wherein the conductor pattern is constituted of a metal thin layer formed in such a way that a metal capable of enhancing the close contact property of the conductor pattern has been sputtered and of a copper-plated layer formed on the metal thin layer. CONSTITUTION:Since a multilayer wiring board 6 uses a metal such as chromium or the like capable of enhancing the close contact property of conductor latterns C1 to C5 as a metal for formation of a metal thin film, it is possible to obtain the conductor patterns hard to strip. In addition, a metal thin layer L1 formed by a sputtering operation is generally dense and smooth, and its adhesion force is excellent. As a result, the metal thin layer TL is used as a substratum for a copper-plated layer L3, and the close contact property of the conductor patterns C1 to C5 can be enhanced even when interlayer insulating layers I1 to I5 are not roughened by chemicals. |
