发明名称 MANUFACTURE OF GLASS CERAMIC MULTILAYER WIRING BOARD
摘要 PURPOSE:To restrain the printing defect of a conductor paste due to the precipitation of a boric acid crystal and to restrain a void from being produced in a laminated body when a multilayer wiring board is manufactured by using borosilicate glass. CONSTITUTION:When a green sheet to manufacture a multilayer wiring board is formed, a base is added, and the precipitation of a crystal is suppressed by a neutralization reaction with boric acid. Thereby, it is possible to obtain the multilayer wiring board which does not contain any void between layers and which is uniform and dense.
申请公布号 JPH0745958(A) 申请公布日期 1995.02.14
申请号 JP19930204430 申请日期 1993.07.28
申请人 HITACHI LTD 发明人 KINOSHITA MADOKA;KATAOKA FUMIO;TAKAHATA SAWAKO;MINAGAWA SHUICHI
分类号 H05K1/03;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/03
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