| 摘要 |
PURPOSE:To attain miniaturization, and to improve reliability. CONSTITUTION:A resist film 16 is formed along almost the entire face of a ground electrode 13 from which the parts of a square soldering part 21 and input and output terminals 10 and 11 are excluded on the upper face of a base substrate 4 without forming a solder land as in the conventional manner. At the time of mounting dielectric coaxial resonators 1-3 on the base substrate 4, a short-circuited face 20 and the side face are formed on the same face as the end face of the base substrate 4. The ground electrode 13 of the base substrate 4 is exposed from the soldering part 21, a solder 22 is placed on the part, the dielectric coaxial resonators 1-3 are arranged, and reflow soldering is operated. Also, the mounting on a wiring substrate at a user side is operated only by the solder land formed on the lower face of the base substrate 4. |
