发明名称 |
Tape carrier package |
摘要 |
A tape carrier package has a base film and leads formed on one side of the base film. The base film defines a device hole therein, while the leads have outer portions to be bonded to a substrate and inner lead portions extending into the device hole. The tape carrier package can be mounted on a substrate by applying a high-frequency electromagnetic field to a portion of each lead which is to be bonded to the substrate, whereby solder applied to the lead or substrate in advance is heated and melted to bond the package to the substrate. |
申请公布号 |
US5390079(A) |
申请公布日期 |
1995.02.14 |
申请号 |
US19920942706 |
申请日期 |
1992.09.09 |
申请人 |
HITACHI, LTD. |
发明人 |
AOMORI, KOKICHI;HONDA, MICHIHARU;OKABE, TOSHIHIRO |
分类号 |
B23K1/002;H01L21/48;H01L23/495;H01L23/50;H05K1/18;H05K3/34;H05K13/04;(IPC1-7):H05K1/00 |
主分类号 |
B23K1/002 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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