| 摘要 |
A novel method and apparatus improves the physical and electrical soldering bond between two electronic components by fluctuating the pressure of a non-oxidizing gas in a chamber which houses the two electronic components throughout a period when the solder has been made molten. This results in the solder effectively filling all crevices and grooves present on the surfaces being soldered. The method is particularly advantageous for soldering a ridge wave-guide laser diode P-side down to a heat sink to improve power capability, longevity and performance of the laser diode.
|
