发明名称 Heating means for thermoplastic bonding
摘要 A heating element for providing localized heating during the thermoplastic bonding of thermoset composite structures is disclosed. Various construction details are developed which disclose an apparatus and method for uniformly heating a bond line. In one embodiment, a heating element (22) includes a resistance heating material (24) sandwiched between two layers of electrical insulation (25) and encased within a layer of thermoplastic material (26). Low resistance electrical leads (28), which extend across the width of the resistance heating material, and a power supply (30) provide electrical energy to raise the temperature of the resistance heating material.
申请公布号 US5389184(A) 申请公布日期 1995.02.14
申请号 US19930168910 申请日期 1993.12.16
申请人 UNITED TECHNOLOGIES CORPORATION 发明人 JACARUSO, GARY J.;DAVIS, GEOFFREY C.;MCINTIRE, ALLEN J.
分类号 B29C65/34;B32B27/12;C08J5/12;C09J5/06;(IPC1-7):B32B31/00;H05B3/34 主分类号 B29C65/34
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