| 摘要 |
PURPOSE:To enable to cool a semiconductor chip in such a manner that a uniform surface temperature will be obtained by a method wherein liquid mist in saturated state is jetted on the back side of each semiconductor chip, and the liquid mist is evaporated on the back side of an LSI chip. CONSTITUTION:The liquid cooling medium sent from a liquid cooling tube 5 is formed into mist 9 by a nozzle 8, and it is sprayed on the back side of an LSI chip 1. When the mist 9 reaches the back side of the LSI chip 1, it is heated up by the LSI chip 1, evaporated instantly and gasified. The LSI chip is cooled by having its heat taken away in the above-mentioned evaporation, but as the diameter of liquid drops of the mist 9 is small, the mist on the LSI chip can be uniformly evaporated at low heating power. The evaporated vapor flows out to outside from a vapor outlet port 6. The vapor lowed out from the vapor outlet 6, it is introduced to a condenser 11 and is gathered once in a receiver 12 after condensation and liquefaction. The liquid cooling medium in the receiver 12 is pumped up by a pump 13, and supplied to the nozzle 8 through a cooling medium introducing pipe 5. |
