发明名称 SEALING STRUCTURE OF ELECTRONIC DEVICE
摘要 PURPOSE:To obtain a small-sized and lightweight sealing structure consisting of simple construction by a method wherein the sealing of the flange attached to an insulative plate and the flange attached to a hat is conducted by performing a welding. CONSTITUTION:The sealing part of an electronic device consists of a flange 3a jointed to an insulative plate 2, whereon a semiconductor element 1 is connected using soldering and the like, and a flange 3b jointed by soldering and the like to a hat 5 whereon an intermediate heat conductive body 8 is attached. An insulative plate 1 and the hat 5 are positioned in such a manner that the center position of a plurality of semiconductor elements 1 jointed to the insulative plate 2 and a plurality of intermediate heat conducting member 8 will be coincided with each other within the prescribed degree of accuracy. Under the above-mentioned condition, the measurements of the flanges 3a and 3b are determined in such a manner that the junction part of the flange 3a jointed to the insulative plate 1 and the flange 3b jointed to the hat 5 will be coincided with each other. The contact of the semiconductor element 1 and the intermediate heat conducting member 8 under the above-mentioned condition is to be maintained in such a manner that it gives no adverse effect on the semiconductor element 1. The junction part of the flanges 3a and 3b is to be sealed by performing a welding after the above- mentioned preparations have been made.
申请公布号 JPS60136342(A) 申请公布日期 1985.07.19
申请号 JP19830243957 申请日期 1983.12.26
申请人 HITACHI SEISAKUSHO KK 发明人 SATOU MOTOHIRO;YAMADA TOSHIHIRO;OOGURO TAKAHIRO;ASHIWAKE NORIYUKI;KOBAYASHI FUMIYUKI
分类号 H01L23/34;H01L21/50;H01L23/02 主分类号 H01L23/34
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