| 摘要 |
PURPOSE:To provide a method and jig by which such semiconductor components that can eliminate the weakness resulting from the incorporation of bare chips in packages and can be applied to bare chips can be manufactured. CONSTITUTION:A burn-in process and succeeding characteristic measurement are performed by using a manufacturing jig whose position can be accurately controlled corresponding to the pitch between electrodes formed on a bare chip. Namely, a method is adopted, by which the electrodes on the bare chip and electrodes for measurement formed on a socket for burn-in can be visually confirmed and, at the same time, oxidation prevention is taken into account. In addition, a picture processing technique is applied to accurately control the positions of the electrodes on the bare semiconductor chip and the electrodes on the socket for burn-in. |
