DOWN-SET FORMING METHOD OF LEAD FRAME

摘要

PURPOSE:To obtain a stable down-set shape in an IC package assembly process. CONSTITUTION:The two ends of the fabricated part of a lead frame 1 are clamped by two sets of electrodes 6 and 7. A voltage is applied between the electrodes 6 and 7 to heat the required part of the lead frame 1 to soften it. The electrodes 7 are displaced to carry out a down-set work keeping the fabricated part soft.