| 摘要 |
There is provided a copper foil for printed circuits characterized by having a coating layer which contains zinc and zinc oxide, chromium oxide and nickel, and either or both of zinc and zinc oxide at least on the shiny side of a copper foil. The coating layer is formed by electroplating using a plating solution which contains either or both of zinc salt and zinc oxide, chromic salt and nickel salt. This copper foil resists discoloration upon exposure to high-temperature conditions of 180 DEG C. for 30 minutes. Resist adhesion is also good. The amounts of deposits are preferably 60 to 80 mu g Zn, 30 to 40 mu g Cr and 5 to 20 mu g Ni per dm2. The matt side of the copper foil may be treated to form thereon a single metal layer or alloy layer of one or more metals chosen from among Cu, Cr, Ni, Fe, Co, and Zn. The copper foil is suited for the fabrication of printed circuits with fine circuit patterns.
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