| 摘要 |
PURPOSE:To eliminate the influence to the positioning accuracy even if the height of a chip is irregular by mounting a spot light at a position vertical to the chip, and emitting the chip from the spot light. CONSTITUTION:A spot light 3 is mounted at a vertical position from the surface of a chip 2, and a bonding tool 1 is mounted at the position separated at the prescribed distance 11 from the bonding surface. Since the emission of the light from the light 3 is performed in the vertical direction by a half mirror 16, even if the height of the chip 2 is irregular, it does not affect the influence to the positioning accuracy. After the positioning is finished, the tool 1 is moved forward at the distance 11 to perform the bonding. Since monitoring means (ITV camera 14) is disposed directly thereabove, the problem of the depth of focus decreases, and the positioning of the operator is facilitated. |
