| 摘要 |
PURPOSE:To make a comparison between the shapes of each pattern on a reference substrate and an inspected substrate, and between the coordinate positions of each pattern, and make judgement about the existence of a wiring pattern defect, based upon the results of both measurements. CONSTITUTION:A pattern inspection device has an X-Y stage 1, a CCD sensor 2, an image processing circuit 3, a frame memory 4, an adder 5, a matrix formation circuit 6, a shape storage memory 7, a shape register memory 8, a coordinate detecting circuit 8, a position storage memory 10, and a defect detecting circuit 11. In this device, the image of a reference substrate is picked up at a learning process, and the shape data of a specified pattern is stored in the memory 8. Also, the coordinate position of the data is stored in the memory 10. At an inspection process, the image of an inspected substrate is picked up, and the circuit 11 makes a comparison between the shape data of the reference substrate and the inspected substrate, as well as between the pattern coordinate positions of the reference substrate and the inspected substrate. When both measurement results agree to each other, the inspected substrate is judged to have no defect. |
