发明名称 Semiconductor assembly
摘要 In a semiconductor assembly in which there are formed on a substrate a circuit having active semiconductor components and an electrically conductive line as well as a voltage supply line for feeding supply voltage to the circuit with the active semiconductor components and a signal line for inputting a signal into this circuit, one of the following three measures is taken on its own or in combination: - the electrically conductive line is subdivided a number of times, and the wiring resistance of each line is reduced to a predetermined or smaller value such that each line has uniform line resistance; - a signal component which responds to a deterioration in the signal curve is added to a signal transmitted via a signal line, in order to achieve an improvement in the deterioration of the signal curve; and/ôor - a capacitance-forming electrode is arranged opposite the voltage supply line, and a capacitor is formed by a dielectric which is inserted between the voltage supply line and the capacitance-forming electrode in order to reduce unwanted radio-frequency signals which occur in the voltage supply line. As a result of these measures, the occurrence of irregular operation in the circuit having active components is reduced to a more substantial degree than before. <IMAGE>
申请公布号 DE4426449(A1) 申请公布日期 1995.02.09
申请号 DE19944426449 申请日期 1994.07.26
申请人 SHARP K.K., OSAKA, JP 发明人 YONEDA, HIROSHI, IKOMA, NARA, JP;YOSHIDA, SHIGETO, TENRI, NARA, JP;KATOH, KENICHI, TENRI, NARA, JP;YAMANE, YASUKUNI, SHIKI, NARA, JP;ISHII, YUTAKA, NARA, JP
分类号 G02F1/13;G02F1/1362;G09G3/36;H01L23/528;(IPC1-7):G09G3/36;G09F9/35 主分类号 G02F1/13
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